<http://webisa.webdatacommons.org/123714967>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.de> .
<http://webisa.webdatacommons.org/123714967>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/prov/158589087>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/123714967> .
<http://webisa.webdatacommons.org/prov/155613378>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/123714967> .
<http://webisa.webdatacommons.org/prov/157087713>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/123714967> .
<http://webisa.webdatacommons.org/123714967>	<http://www.w3.org/ns/prov#value>	"Each individual die has a number of pins or bond pads 19 for providing power, ground, and signals such as data, address, control, etc. to the die." .