<http://webisa.webdatacommons.org/124348967>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .
<http://webisa.webdatacommons.org/124348967>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/prov/292921973>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/124348967> .
<http://webisa.webdatacommons.org/124348967>	<http://www.w3.org/ns/prov#value>	"During the packaging process, several semiconductor die are attached to a lead frame, often with a material such as epoxy or other viscous adhesives." .