<http://webisa.webdatacommons.org/prov/352523873>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/124469751> .
<http://webisa.webdatacommons.org/prov/316406426>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/124469751> .
<http://webisa.webdatacommons.org/prov/185890465>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/124469751> .
<http://webisa.webdatacommons.org/124469751>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/124469751>	<http://www.w3.org/ns/prov#value>	"Substrates which are suitable for use with the present invention include materials such as ceramic, silican, porcelain, conventional printed circuit board materials, or other conventional substrates suitable for electrical circuits." .
<http://webisa.webdatacommons.org/124469751>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .