<http://webisa.webdatacommons.org/127861386>	<http://www.w3.org/ns/prov#value>	"through-hole connector 7906, for attaching the upper face 7901a of the substrate 7901 to the lower face 7904b of the spacer 7904, bumps 7908 (i.e., protrusions formed of a material such as solder, formed on a flip-chip IC to serve as connector elements" .
<http://webisa.webdatacommons.org/prov/104273885>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/127861386> .
<http://webisa.webdatacommons.org/127861386>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/127861386>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<patents.com> .