<http://webisa.webdatacommons.org/129745148>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.co.uk> .
<http://webisa.webdatacommons.org/129745148>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/prov/332764365>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/129745148> .
<http://webisa.webdatacommons.org/129745148>	<http://www.w3.org/ns/prov#value>	"FIG. 5A is a top plan view of an embodiment of the encapsulation package assembly of the present invention, similar to the embodiment shown in FIG. 1A with an additional electronic component disposed in an outer chamber of the package;" .