<http://webisa.webdatacommons.org/130097759>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/130097759>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .
<http://webisa.webdatacommons.org/prov/246276219>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/130097759> .
<http://webisa.webdatacommons.org/130097759>	<http://www.w3.org/ns/prov#value>	"FIG. 14A is a plan view of mounting a number of triangular semiconductor packages on a printed circuit mother board, according to the present invention." .