<http://webisa.webdatacommons.org/130412938>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/130412938>	<http://www.w3.org/ns/prov#value>	"FIG. 4A is a plan view of grinding device of a wafer-polishing apparatus according to the present invention." .
<http://webisa.webdatacommons.org/prov/333932814>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/130412938> .
<http://webisa.webdatacommons.org/130412938>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.es> .