<http://webisa.webdatacommons.org/130427941>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .
<http://webisa.webdatacommons.org/130427941>	<http://www.w3.org/ns/prov#value>	"FIG. 7 is a plan view showing the semiconductor device as the embodiment 2 while omitting the sealing resin;" .
<http://webisa.webdatacommons.org/prov/249871569>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/130427941> .
<http://webisa.webdatacommons.org/130427941>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .