<http://webisa.webdatacommons.org/130550655>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<freshpatents.com> .
<http://webisa.webdatacommons.org/130550655>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/130550655>	<http://www.w3.org/ns/prov#value>	"FIG. 10 is a plan view showing a layered structure of a feed circuit board of each of the wireless IC devices according to the fourth and fifth preferred embodiments of the present invention." .
<http://webisa.webdatacommons.org/prov/249871572>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/130550655> .