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<http://webisa.webdatacommons.org/prov/249871573>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/130628433> .
<http://webisa.webdatacommons.org/130628433>	<http://www.w3.org/ns/prov#value>	"FIG. 11 is a plan view showing the vertical semiconductor apparatus of a conductive resin joint type of the fourth embodiment, FIG. 12 is a cross sectional view taken along a line B-B shown in FIG. 11, and FIG. 13 is an enlarged cross sectional view showing a state of a region surrounded by a chain line D shown in FIG. 12 before joint by conductive resin." .
<http://webisa.webdatacommons.org/130628433>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.fr> .