<http://webisa.webdatacommons.org/132253184>	<http://www.w3.org/ns/prov#value>	"The present invention relates to a semiconductor device manufacturing method and a semiconductor device, particularly to a method for assembling a semiconductor device comprising a wiring board and a semiconductor chip, mounted on the wiring board as a flip chip and thereafter secured by an underfill resin." .
<http://webisa.webdatacommons.org/132253184>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .
<http://webisa.webdatacommons.org/132253184>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/prov/397891953>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/132253184> .
<http://webisa.webdatacommons.org/prov/387628012>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/132253184> .