<http://webisa.webdatacommons.org/prov/448893642>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/137027449> .
<http://webisa.webdatacommons.org/137027449>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com.au> .
<http://webisa.webdatacommons.org/137027449>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/137027449>	<http://www.w3.org/ns/prov#value>	"In accordance with yet an additional feature of the invention, particularly in the course of fabricating edge-emitting semiconductor laser chips, the mask layer is removed prior to the severing step." .