<http://webisa.webdatacommons.org/prov/296072988>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/137642175> .
<http://webisa.webdatacommons.org/137642175>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .
<http://webisa.webdatacommons.org/prov/428124309>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/137642175> .
<http://webisa.webdatacommons.org/137642175>	<http://www.w3.org/ns/prov#value>	"Additionally, chemicals such as water or other solutions can be applied to the surface of the wafer so that the solution is between the wafer and the cleaning rod during the time the cleaning rod is powered." .
<http://webisa.webdatacommons.org/prov/58752242>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/137642175> .
<http://webisa.webdatacommons.org/137642175>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .