<http://webisa.webdatacommons.org/prov/44773426>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/138164471> .
<http://webisa.webdatacommons.org/138164471>	<http://www.w3.org/ns/prov#value>	"While the electronic packages of the invention have been described in terms of primarily metallic bases, the bases can also be formed from other suitable materials such as plastics, ceramics, metal/ceramic composites (cermets) and glass/ceramic composites (cerglasses)." .
<http://webisa.webdatacommons.org/138164471>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/138164471>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .