<http://webisa.webdatacommons.org/prov/143524013>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/140654715> .
<http://webisa.webdatacommons.org/140654715>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/140654715>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com.au> .
<http://webisa.webdatacommons.org/140654715>	<http://www.w3.org/ns/prov#value>	"Accordingly, provided is a method of forming a microelectronic device including a wafer thinning process that is performed subsequent to bonding of a sensor component 100 and a capping component 200 into a combined wafer structure." .