<http://webisa.webdatacommons.org/14256854>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<polyu.edu.hk> .
<http://webisa.webdatacommons.org/14256854>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/prov/289646341>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/14256854> .
<http://webisa.webdatacommons.org/14256854>	<http://www.w3.org/ns/prov#value>	"The parameters including CNT thickness and exposure time of the proposed bonding method were further optimized to seal the plastic biochips." .