<http://webisa.webdatacommons.org/prov/158466156>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/14486364> .
<http://webisa.webdatacommons.org/14486364>	<http://www.w3.org/ns/prov#value>	"The method of claim 19, wherein said object includes one of a semiconductor wafer, semiconductor die, leadframe and other electronic device." .
<http://webisa.webdatacommons.org/14486364>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/prov/211560322>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/14486364> .
<http://webisa.webdatacommons.org/14486364>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .
<http://webisa.webdatacommons.org/prov/135615246>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/14486364> .