<http://webisa.webdatacommons.org/152785093>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.fr> .
<http://webisa.webdatacommons.org/152785093>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/152785093>	<http://www.w3.org/ns/prov#value>	"In an exemplary embodiment, a bond pad is formed on the die 102/104 and on interposer 101 such that an interconnect wire can be appropriately connected to the pad using an adhesive, tape, solder or other connecting technique." .
<http://webisa.webdatacommons.org/prov/420568918>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/152785093> .
<http://webisa.webdatacommons.org/prov/287169651>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/152785093> .
<http://webisa.webdatacommons.org/prov/262824889>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/152785093> .