<http://webisa.webdatacommons.org/prov/35580831>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/157083442> .
<http://webisa.webdatacommons.org/157083442>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/157083442>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<freshpatents.com> .
<http://webisa.webdatacommons.org/prov/55995050>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/157083442> .
<http://webisa.webdatacommons.org/prov/516107197>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/157083442> .
<http://webisa.webdatacommons.org/prov/36885737>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/157083442> .
<http://webisa.webdatacommons.org/157083442>	<http://www.w3.org/ns/prov#value>	"Examples of materials suitable for use in making device 205 include, but are not limited to, nickel, stainless steel, metal oxides, high heat-resistant polymers, such as polytetrafluoroethylene (PTFE), ceramics and minerals." .