. . . "to the methods of the present invention is that they have good adhesion to various materials such as silicon, silicon dioxide, silicon oxynitride, silicon nitride, or quartz, ceramic, alumina, BT-laminate, FR-4, various polymers such as poly(phthalamide) (PPA), poly(phenylene sulfide) (PPS), polyetherimide (PEI), poly(amide imide) (PAI), epoxy, polyimide, polyamide, polyester, polyacrylate, and th" . .