<http://webisa.webdatacommons.org/164026822>	<http://www.w3.org/ns/prov#value>	"FIG. 2 is a sectional view of a wafer and apparatus for plating on an active surface of the wafer in accordance with one embodiment of the invention; and" .
<http://webisa.webdatacommons.org/prov/262095123>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/164026822> .
<http://webisa.webdatacommons.org/164026822>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/164026822>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.es> .