<http://webisa.webdatacommons.org/166542610>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .
<http://webisa.webdatacommons.org/166542610>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/166542610>	<http://www.w3.org/ns/prov#value>	"The present invention is particularly suitable for polishing very high density semiconductor substrate and memory devices." .
<http://webisa.webdatacommons.org/prov/419887023>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/166542610> .