<http://webisa.webdatacommons.org/168438349>	<http://www.w3.org/ns/prov#value>	"FIG. 3 is a cross-section elevation of an organic substrate thin-film capacitor composite die-and-interposer package 300 according to an embodiment." .
<http://webisa.webdatacommons.org/prov/262929191>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/168438349> .
<http://webisa.webdatacommons.org/168438349>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .
<http://webisa.webdatacommons.org/168438349>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .