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<http://webisa.webdatacommons.org/prov/249871575>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/168698889> .
<http://webisa.webdatacommons.org/168698889>	<http://www.w3.org/ns/prov#value>	"FIG. 13 is a plan view illustrating an arrangement of supporting solder bumps 102 in accordance with an example embodiment of the present invention." .
<http://webisa.webdatacommons.org/168698889>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.ca> .