<http://webisa.webdatacommons.org/170151910>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/170151910>	<http://www.w3.org/ns/prov#value>	"This is then followed by application of the glue, solder, or other material and subsequent bonding of the IC or package to the package or PCB respectively." .
<http://webisa.webdatacommons.org/prov/104273885>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/170151910> .
<http://webisa.webdatacommons.org/170151910>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .