<http://webisa.webdatacommons.org/171154269>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/171154269>	<http://www.w3.org/ns/prov#value>	"The bare semiconductor dice are then wire bonded to the printed circuit board by a wire bonding apparatus, which typically connects the dice to the circuit board by means of wires, such as gold, aluminum, or other suitable metal or alloy." .
<http://webisa.webdatacommons.org/prov/363606107>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/171154269> .
<http://webisa.webdatacommons.org/171154269>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .