<http://webisa.webdatacommons.org/179096139>	<http://www.w3.org/ns/prov#value>	"The semiconductor device according to claim 1, wherein the semiconductor chip is a light emitting element or a light receiving element, the upper surface of the resin package being provided with a convex lens portion at a location" .
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<http://webisa.webdatacommons.org/prov/2646225>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/179096139> .
<http://webisa.webdatacommons.org/179096139>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<patents.com> .