<http://webisa.webdatacommons.org/190216086>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/190216086>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .
<http://webisa.webdatacommons.org/190216086>	<http://www.w3.org/ns/prov#value>	"A mechanism is provided, such as a spring or vacuum device or pneumatic ram, to exert a shearing force on the substrate while the chip is held on the bottom plate by the protrusions as the temperature is raised." .
<http://webisa.webdatacommons.org/prov/425273470>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/190216086> .
<http://webisa.webdatacommons.org/prov/423049535>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/190216086> .