<http://webisa.webdatacommons.org/194618104>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<patentgenius.com> .
<http://webisa.webdatacommons.org/194618104>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/prov/44773412>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/194618104> .
<http://webisa.webdatacommons.org/prov/62365820>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/194618104> .
<http://webisa.webdatacommons.org/194618104>	<http://www.w3.org/ns/prov#value>	"For instance, instead of a PCB, the MCP substrate could be or include, for example, ceramic, silicon, sapphire, or other suitable material." .