<http://webisa.webdatacommons.org/195199355>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/195199355>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .
<http://webisa.webdatacommons.org/prov/74089022>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/195199355> .
<http://webisa.webdatacommons.org/195199355>	<http://www.w3.org/ns/prov#value>	"Where bond pads are overhung by another die, wire bonding is successfully accomplished without the use of thick adhesive layers. [0024] The substrate may be any body which supports the device, including for example, a circuit board, circuit card such as a multiple memory card, a lead frame or a tape automated bonding (TAB) tape." .