<http://webisa.webdatacommons.org/prov/263717575>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/196382338> .
<http://webisa.webdatacommons.org/196382338>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com.au> .
<http://webisa.webdatacommons.org/196382338>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/196382338>	<http://www.w3.org/ns/prov#value>	"One or more IC packages can be physically and electrically coupled to a substrate such as a printed circuit board (PCB) or motherboard to form an ???electronic assembly???." .
<http://webisa.webdatacommons.org/prov/277010641>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/196382338> .