<http://webisa.webdatacommons.org/prov/217895792> <http://www.w3.org/ns/prov#wasDerivedFrom> <http://webisa.webdatacommons.org/197411928> . <http://webisa.webdatacommons.org/197411928> <http://www.w3.org/ns/prov#value> "Described in another embodiment of the invention is a process of fabricating a BGAP having three-bump solder joints." . <http://webisa.webdatacommons.org/197411928> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://www.w3.org/ns/prov#Entity> . <http://webisa.webdatacommons.org/197411928> <http://www.w3.org/ns/prov#wasQuotedFrom> <google.de> .