<http://webisa.webdatacommons.org/prov/217895792>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/197411928> .
<http://webisa.webdatacommons.org/197411928>	<http://www.w3.org/ns/prov#value>	"Described in another embodiment of the invention is a process of fabricating a BGAP having three-bump solder joints." .
<http://webisa.webdatacommons.org/197411928>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/197411928>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.de> .