<http://webisa.webdatacommons.org/prov/104273885>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/19955690> .
<http://webisa.webdatacommons.org/19955690>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/19955690>	<http://www.w3.org/ns/prov#value>	"In a next step of the process 1100, shown in FIG. 11C, the masking material 1110 is removed and a joining material such as solder paste 1124 or the like is applied to a portion of the exposed (top, as viewed) surfaces of the beam components 1120." .
<http://webisa.webdatacommons.org/19955690>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.ca> .