<http://webisa.webdatacommons.org/200804472>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/200804472>	<http://www.w3.org/ns/prov#value>	"The present invention is a structure and a method of packaging memory chips in a 3-D form factor on a flex circuit while keeping individual chips independent in a way such that each one of them can be replaced freely." .
<http://webisa.webdatacommons.org/prov/352352275>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/200804472> .
<http://webisa.webdatacommons.org/200804472>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.fr> .