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<http://webisa.webdatacommons.org/200994873>	<http://www.w3.org/ns/prov#value>	"The present invention is a structure and a method of packaging memory chips in a 3-D form factor on a flex circuit while keeping individual chips independent in a way such that each one of them can be replaced freely." .
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<http://webisa.webdatacommons.org/200994873>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .