<http://webisa.webdatacommons.org/prov/352352275> <http://www.w3.org/ns/prov#wasDerivedFrom> <http://webisa.webdatacommons.org/200994873> . <http://webisa.webdatacommons.org/200994873> <http://www.w3.org/ns/prov#value> "The present invention is a structure and a method of packaging memory chips in a 3-D form factor on a flex circuit while keeping individual chips independent in a way such that each one of them can be replaced freely." . <http://webisa.webdatacommons.org/200994873> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://www.w3.org/ns/prov#Entity> . <http://webisa.webdatacommons.org/200994873> <http://www.w3.org/ns/prov#wasQuotedFrom> <google.com> .