<http://webisa.webdatacommons.org/prov/423339218>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/21837124> .
<http://webisa.webdatacommons.org/21837124>	<http://www.w3.org/ns/prov#value>	"The present disclosure relates generally to manufacturing components and in particular to a method and apparatus for shaping materials for components." .
<http://webisa.webdatacommons.org/21837124>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/21837124>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .