<http://webisa.webdatacommons.org/224209608>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com.au> .
<http://webisa.webdatacommons.org/prov/24770689>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/224209608> .
<http://webisa.webdatacommons.org/224209608>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/224209608>	<http://www.w3.org/ns/prov#value>	"Then, an assembling process such as a dicing operation, a wire bonding operation, or a packaging operation is performed whereby semiconductor devices are manufactured." .