<http://webisa.webdatacommons.org/prov/5608060>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/233763350> .
<http://webisa.webdatacommons.org/233763350>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/prov/432512708>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/233763350> .
<http://webisa.webdatacommons.org/prov/515869326>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/233763350> .
<http://webisa.webdatacommons.org/233763350>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<freshpatents.com> .
<http://webisa.webdatacommons.org/prov/3920427>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/233763350> .
<http://webisa.webdatacommons.org/233763350>	<http://www.w3.org/ns/prov#value>	"The supporting substrate 12 may be formed of another material having no conductivity but high thermal conductivity, such as, for example, alumina, mullite, ceramic, such as glass ceramic, glass epoxy, or the like." .