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<http://webisa.webdatacommons.org/prov/9501679>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/235749445> .
<http://webisa.webdatacommons.org/235749445>	<http://www.w3.org/ns/prov#value>	"In the present embodiment of the invention, the module 400 is used to clean the substrate 408 using, for example, NH4OH, H2O2, deionized water, buffered oxide etch (BOE) chemicals, solvents such as EKC 265, and the like." .
<http://webisa.webdatacommons.org/235749445>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .