<http://webisa.webdatacommons.org/prov/333825254>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/236744989> .
<http://webisa.webdatacommons.org/236744989>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/236744989>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .
<http://webisa.webdatacommons.org/prov/334275710>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/236744989> .
<http://webisa.webdatacommons.org/236744989>	<http://www.w3.org/ns/prov#value>	"FIGS. 7A and 7B are a schematic side and a plan view of a part of the plasma etching apparatus for measuring uniformity of the plasma according to the present invention, respectively." .