<http://webisa.webdatacommons.org/prov/337149347>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/242431354> .
<http://webisa.webdatacommons.org/242431354>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .
<http://webisa.webdatacommons.org/prov/319838934>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/242431354> .
<http://webisa.webdatacommons.org/242431354>	<http://www.w3.org/ns/prov#value>	"In particular, the invention relates to a semiconductor device used as a wireless chip formed over an insulating substrate such as glass and plastic." .
<http://webisa.webdatacommons.org/242431354>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .