<http://webisa.webdatacommons.org/24369441>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .
<http://webisa.webdatacommons.org/prov/336428657>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/24369441> .
<http://webisa.webdatacommons.org/24369441>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/prov/316406426>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/24369441> .
<http://webisa.webdatacommons.org/24369441>	<http://www.w3.org/ns/prov#value>	"Further, the present invention may be used to form a semiconductor device or circuit on other insulating substrates such as resin or ceramics." .