<http://webisa.webdatacommons.org/prov/250973366>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/244548933> .
<http://webisa.webdatacommons.org/244548933>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .
<http://webisa.webdatacommons.org/244548933>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/244548933>	<http://www.w3.org/ns/prov#value>	"FIG. 11A is a plan view illustrating an exemplary semiconductor wafer substrate, in which a resistance value between terminals is determined by selecting a region to which metal paste is adhered and thereby differentiating formation regions of a metal wiring layer in an opening, and in which the metal wiring layer is formed in the entire region of the opening;" .