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<http://webisa.webdatacommons.org/253519943>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .
<http://webisa.webdatacommons.org/253519943>	<http://www.w3.org/ns/prov#value>	"e, a sealing member for sealing the surroundings of the semiconductor chip and the conductive member, and external terminals bonded to the lands, wherein the adhesive member is provided to cover to a region including the lands that are located outside the edge of the semiconductor chip and at least close to the edge of the semiconductor chip." .
<http://webisa.webdatacommons.org/prov/310135102>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/253519943> .