. . "FIG. 20A is a top plan view of a carrier energy conditioning circuit assembly comprising a shielded twisted pair feed through differential and common mode filter embedded in a multi-layer substrate carrier within an integrated circuit package; and FIG. 20B is a front cross-sectional view of the integrated circuit package of FIG. 20A; and FIG. 20C is a top plan view of the ground plane layer of the" . .