<http://webisa.webdatacommons.org/259378561>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/prov/232326686>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/259378561> .
<http://webisa.webdatacommons.org/259378561>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .
<http://webisa.webdatacommons.org/259378561>	<http://www.w3.org/ns/prov#value>	"FIG. 2 is a process drawing showing the method of producing the multilayered wiring board according to a first embodiment of the present invention." .