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<http://webisa.webdatacommons.org/25984533>	<http://www.w3.org/ns/prov#value>	"ing characteristics of a polishing pad used in polishing micro-device workpiecesUS707411416 Jan 200311 Jul 2006Micron Technology, Inc.Carrier assemblies, polishing machines including carrier assemblies, and methods for polishing micro-device workpiecesUS70869279 Mar 20048 Aug 2006Micron Technology, Inc.Methods and systems for planarizing workpieces, e.g., microelectronic workpiecesUS70869298 Jul 2" .