<http://webisa.webdatacommons.org/prov/441685531>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/26065497> .
<http://webisa.webdatacommons.org/26065497>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .
<http://webisa.webdatacommons.org/26065497>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/26065497>	<http://www.w3.org/ns/prov#value>	"Field of the Invention The present invention relates to a method of manufacturing a thin film integrated circuit device carrying a thin film integrated circuit that has an element such as a memory and a microprocessor (CPU: Central Processing Unit) and is thin and flexible like paper, and to a non-contact type thin film integrated circuit device including the thin film integrated circuit and an an" .