<http://webisa.webdatacommons.org/263534850>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .
<http://webisa.webdatacommons.org/prov/303458253>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/263534850> .
<http://webisa.webdatacommons.org/263534850>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/263534850>	<http://www.w3.org/ns/prov#value>	"subsequently, etching the wafer of crystalline material to form at least one cutting device including at least one cutting edge comprising at least a portion of the at least one blade profile," .