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<http://webisa.webdatacommons.org/prov/299803727>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/264873714> .
<http://webisa.webdatacommons.org/prov/440023672>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/264873714> .
<http://webisa.webdatacommons.org/264873714>	<http://www.w3.org/ns/prov#value>	"In other words, the sensor chip is split-structured so that the circuits such as the sensors and the microprocessor are formed on the front side (SIDE1) while the MEMS variable capacitor is formed on the back side (SIDE2) of the chip." .
<http://webisa.webdatacommons.org/264873714>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.es> .